LOCTITE® ABLESTIK SSP 2020

旧名称 LOCTITE ABLESTIK SSP 2020 18G

特長および利点

LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach
LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.
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技術情報

アプリケーション(用途) ダイ接着剤
引張係数, @ 250.0 °C 5615.0 N/mm² (800000.0 psi )
抽出可能なイオン含有量, カリウム(K+) 0.9 ppm
抽出可能なイオン含有量, ナトリウム(Na+) 0.9 ppm
抽出可能なイオン含有量, 塩化物 (CI-) 0.9 ppm
硬化タイプ 熱硬化