LOCTITE® ABLESTIK SSP 2020

Known as LOCTITE ABLESTIK SSP 2020 18G

Features and Benefits

LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach
LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.
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Technical Information

Applications Die attach
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 0.9 ppm
Extractable ionic content, Potassium (K+) 0.9 ppm
Extractable ionic content, Sodium (Na+) 0.9 ppm
Tensile modulus, @ 250.0 °C 5615.0 N/mm² (800000.0 psi )