BERGQUIST® GAP PAD® TGP HC5000
Conosciuto come Gap Pad® HC 5.0
Caratteristiche e vantaggi
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Informazioni tecniche
Classe di infiammabilità | V-0 |
Conducibilità termica | 5.0 W/mK |
Modulo di Young, ASTM D575 | 121.0 KPa (17.5 psi ) |
Temperatura di esercizio | -60.0 - 200.0 °C |
Tipo carrier | Fibra di vetro |