BERGQUIST® HI FLOW THF 700FT
Conosciuto come Hi-Flow® 225FT
Caratteristiche e vantaggi
BERGQUIST HI FLOW THF 700FT, Reworkable, Pressure Sensitive Phase Change Material
BERGQUIST® HI FLOW THF 700FT reworkable thermal interface material provides a low thermal resistance path between hot components such as high performance processors and heat sinks. The material consists of a 55°C phase change compound bonded to one side of a conformable metal foil. This pressure sensitive material is easily applied to the heat sink and securely conforms to many mounting surfaces. Its compliant foil allows for easy release and reworking without leaving residue on CPU surfaces. Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 700FT wets-out the heat sink interface and flows to produce exceptional thermal performance. The thixotropic design of BERGQUIST HI FLOW THF 700FT requires pressure of the assembly to cause displacement and/or flow.
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Informazioni tecniche
Classe di infiammabilità | V-0 |
Colore | Nero |
Conducibilità termica | 0.7 W/mK |
Temperatura di esercizio | 120.0 °C |
Tipo carrier | Alluminio |