LOCTITE® ABLESTIK CE 8500-S39
Merkmale und Vorteile
This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).
LOCTITE® ABLESTIK CE 8500-S39 is a 1-part, solvent-free, electrically conductive, modified epoxy adhesive for component assembly. It combines low stress with good adhesion on nearly all surfaces, and is ideal for mismatched substrates, including applications with mismatched CTE (Coefficient of Thermal Expansion). It has 39 µm spacers for bondline thickness control, and its operating temperature is -45°C to 200°C (-49°F to 392°F).
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Technische Informationen
| Anzahl Komponenten | 1K |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 120.0 °C | 90.0 Min. |
| Betriebstemperatur | 200.0 °C |
| Lagertemperatur | -25.0 - -18.0 °C |
| Scherfestigkeit | 435.0 psi |
| Viskosität, Brookfield, @ 25.0 °C Spindle TD, Speed 10 rpm | 130000.0 mPa.s (cP) |
LOCTITE® ABLESTIK CE 8500-S39
This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).