LOCTITE® ABLESTIK CE 8500-S39
Features and Benefits
This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).
LOCTITE® ABLESTIK CE 8500-S39 is a 1-part, solvent-free, electrically conductive, modified epoxy adhesive for component assembly. It combines low stress with good adhesion on nearly all surfaces, and is ideal for mismatched substrates, including applications with mismatched CTE (Coefficient of Thermal Expansion). It has 39 µm spacers for bondline thickness control, and its operating temperature is -45°C to 200°C (-49°F to 392°F).
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Technical Information
| Cure schedule, @ 120.0 °C | 90.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Operating temperature | 200.0 °C |
| Shear strength | 435.0 psi |
| Storage temperature | -25.0 - -18.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle TD, Speed 10 rpm | 130000.0 mPa·s (cP) |
LOCTITE® ABLESTIK CE 8500-S39
This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).