LOCTITE® ABLESTIK CE 8500-S39

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This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion). 
LOCTITE® ABLESTIK CE 8500-S39 is a 1-part, solvent-free, electrically conductive, modified epoxy adhesive for component assembly. It combines low stress with good adhesion on nearly all surfaces, and is ideal for mismatched substrates, including applications with mismatched CTE (Coefficient of Thermal Expansion). It has 39 µm spacers for bondline thickness control, and its operating temperature is -49°F to 392°F (-45°C to 200°C). 
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Información técnica

Número de Componentes Monocomponente
Programa de curado, @ 120.0 °C 90.0 min
Resistencia al corte 435.0 psi
Temperatura de almacenaje -25.0 - -18.0 °C
Temperatura de funcionamiento 200.0 °C
Tipo de curado Curado Térmico
Viscosidad, Brookfield, @ 25.0 °C Spindle TD, Speed 10 rpm 130000.0 mPa.s (cP)