LOCTITE® ABLESTIK CE 8500-S39
Vlastnosti a výhody
This 1-part, solvent-free, electrically conductive adhesive combines low stress with good adhesion on nearly all surfaces, including applications with mismatched CTE (Coefficient of Thermal Expansion).
LOCTITE® ABLESTIK CE 8500-S39 is a 1-part, solvent-free, electrically conductive, modified epoxy adhesive for component assembly. It combines low stress with good adhesion on nearly all surfaces, and is ideal for mismatched substrates, including applications with mismatched CTE (Coefficient of Thermal Expansion). It has 39 µm spacers for bondline thickness control, and its operating temperature is -45°C to 200°C (-49°F to 392°F).
Oblasti Použití
Dokumenty ke stažení
Hledáte TS nebo BL v jiném jazyce?
Technické informace
Pevnost ve střihu | 435.0 psi |
Plán vytvrzení, @ 120.0 °C | 90.0 min. |
Počet složek | 1 složka |
Provozní teplota | 200.0 °C |
Teplota skladování | -25.0 - -18.0 °C |
Viskozita, Brookfield, @ 25.0 °C Spindle TD, Speed 10 rpm | 130000.0 mPa.s (cP) |
Způsob vytvrzování | Vytvrzování teplem |