LOCTITE® ECCOBOND UF 3711 Specially designed for the Data & Telecom Market
Features and Benefits
LOCTITE® ECCOBOND UF 3711 is curable encapsulant formulated for chips to enhance the reliability performance
LOCTITE® ECCOBOND UF 3711 curable adhesive is formulated for chips to enhance the reliability performance. It provides a uniformand void-free encapsulant edgebond, maximizing the device'stemperature cycling capability, distributing stress away from solderconnects, as well as improving device’s reliability under hightemperatures and high humidity.
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Documents and Downloads
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LOCTITE® ECCOBOND UF 3711
LOCTITE® ECCOBOND UF 3711 is curable encapsulant formulated for chips to enhance the reliability performance