LOCTITE® ECCOBOND UF 3711
Features and Benefits
This 1-part, epoxy-based, UV-curable white encapsulant is designed for chips to enhance reliability.
LOCTITE® ECCOBOND UF 3711 is a white, thixotropic encapsulant paste for chips to enhance reliability under high temperatures and high humidity. It’s typically used for edge bonding, providing a uniform, void-free layer that optimizes the device's temperature cycling capability and directs stress away from solder connections. It is formulated with an epoxy-based resin and cures with low shrinkage when exposed to UV irradiation or UV and heat.
- Thixotropic for ease of application
- Service/operating temperature: -40°C to 125°C (-40°F to 257°F)
- Very low coefficient of thermal expansion (CTE)
- High glass transition temperature (Tg) and modulus
- UV curable
Documents and Downloads
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LOCTITE® ECCOBOND UF 3711
This 1-part, epoxy-based, UV-curable white encapsulant is designed for chips to enhance reliability.