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BERGQUIST® LIQUI FORM TLF 10000 - 1.0/case

Features and Benefits

A 1-part, red, silicone-based, fully-cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.
  • Dispensable pre-cured: requires no mixing or refrigeration
  • Excellent thermal cycling performance & dispense properties
  • Thermal conductivity: 10 W/m-K, ASTM D5470
  • Low thermal impedance at thin and thick gaps
  • Low compression set to reduce stress on components
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Documents and Downloads

Safety Data Sheets and RoHs
BERGQUIST® LIQUI FORM TLF 10000 2746327 en-US
IDH: 2746327

Quantity: 1.0/case

BERGQUIST® LIQUI FORM TLF 10000 2746330 en-US
IDH: 2746330

Quantity: 16.0/case

BERGQUIST® LIQUI FORM TLF 10000, 1 gallon pail Pail 2796659 en-US
IDH: 2796659

Size Case: Pail

Quantity: 1.0/case

No documents found

Technical Information

Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Shelf life, @ 0.0 - 35.0 °C 180.0 day
Thermal conductivity 10.0 W/mK

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