LOCTITE® ECCOBOND DAM 7010C

LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.