LOCTITE® ABLESTIK 2815A

功能与优点

LOCTITE ABLESTIK 2815A, Acrylate, Die Attach
LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring high heat extraction from die.
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技术信息

RT 模剪切强度 5.8 kg-f
可萃取出的离子含量, 氯化物 (CI-) 19.0 ppm
可萃取出的离子含量, 钠 (Na+) 19.0 ppm
可萃取出的离子含量, 钾 (K+) 9.0 ppm
固化方式 热+紫外线
应用 芯片焊接
拉伸模量, @ 250.0 °C 1600.0 N/mm² (230000.0 psi )
热膨胀系数 (CTE) 64.0 ppm/°C