LOCTITE® ABLESTIK 2815A

Features and Benefits

LOCTITE ABLESTIK 2815A, Acrylate, Die Attach
LOCTITE® ABLESTIK 2815A die attach adhesive is designed to minimize thermal resistance between the chip and substrate. It provides improved workability for applications requiring high heat extraction from die.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 64.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Potassium (K+) 9.0 ppm
Extractable ionic content, Sodium (Na+) 19.0 ppm
RT die shear strength 5.8 kg-f
Tensile modulus, @ 250.0 °C 1600.0 N/mm² (230000.0 psi )