LOCTITE® ECCOBOND LA 3032-78

Vlastnosti a výhody

LOCTITE ECCOBOND LA 3032-78, Chemically resistant, Epoxy, Encapsulant
LOCTITE® ECCOBOND LA 3032-78 encapsulant is designed for high throughput assembly operations. It is formulated to withstand high heat distortion temperatures and bonds well to engineering plastics
Viac info

Technické informácie

Casson Viskozita, Cone diameter 2 cm, Angle 2° Shear Rate 50 s⁻¹ 500000.0 mPa.s (cP)
Modul skladovania, @ 25.0 °C Ramp Rate 3 °C/min., 1 Hz, 10μm 3700.0 N/mm² (536639.0 psi )
Plán vytvrdnutia, @ 100.0 °C 15.0 min.
Plán vytvrdnutia, @ 120.0 °C 3.0 min.
Teplota priepustnosti skla (Tg) 110.0 °C
Tixotropný index 6.5