Advancements In Packaging Technology This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development. Read More
Whitepaper: Reliability that Sticks - Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Thermal Adhesive Films Offer Outstanding Performance in Easy-to-Use Format Read More
Whitepaper: Beyond Thermal Grease - Enhancing Thermal Performance and Reliability Power electronics based on silicon devices must operate below 125°C and IGBTs under 150°C. Future SiC devices could extend this to 200°C. Thermal management of power electronics requires interfacing the package to a heat sink using a thermal interface material (TIM). Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More