Advancements In Packaging Technology This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development. Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More