LOCTITE® ABLESTIK QMI519
특징 및 이점
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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문서 및 다운로드
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기술 정보
| RT 다이 전단 강도 | 59.0 kg-f |
| 경화 방식 | 열경화 |
| 열팽창 계수(CTE) | 40.0 ppm/°C |
| 적용 분야 | 다이 접착 |
| 추출 가능 이온 함량, 나트륨 이온(Na+) | 20.0 ppm |
| 추출 가능 이온 함량, 볼소 이온(F-) | 20.0 ppm |
| 추출 가능 이온 함량, 염소 이온(CI-) | 20.0 ppm |
| 추출 가능 이온 함량, 칼륨 이온(K+) | 20.0 ppm |
| 탄성 계수, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.