LOCTITE® ABLESTIK QMI519
功能與優點
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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技術資訊
| RT 模剪切強度 | 59.0 kg-f |
| 可萃取出的離子含量, 氟化物(F-) | 20.0 ppm |
| 可萃取出的離子含量, 氯化物(CI-) | 20.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 20.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 20.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 楊氏模量, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| 熱膨脹係數 (CTE) | 40.0 ppm/°C |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.