LOCTITE® ABLESTIK QMI519
特長および利点
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.
LOCTITE® ABLESTIK QMI519 is a single component, hydrophobic, silver filled conductive that is stable at high temperatures and provides good resistance to “popcorning” when exposed to reflow temperatures. This product also provides high resistance to delamination and is designed to achieve higher UPHs than conventional oven cured adhesives.
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技術情報
| RTダイせん断強度 | 59.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ヤング率, @ 25.0 °C | 5300.0 N/mm² (769000.0 psi ) |
| 抽出可能なイオン含有量, カリウム(K+) | 20.0 ppm |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 20.0 ppm |
| 抽出可能なイオン含有量, フッ化物 (F-) | 20.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 20.0 ppm |
| 熱膨張率 | 40.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK QMI519
LOCTITE ABLESTIK QMI519 is a thermally and electrically conductive, silver filled adhesive ideal for bonding components and integrated circuits to metal leadframes.