LOCTITE® ABLESTIK CT 5047-2

Caratteristiche e vantaggi

Low-temperature cure adhesive designed to make electrical connections where hot soldering is impractical, or to conductive plastics where high temperatures aren’t possible.
When you need an electrically conductive adhesive but can’t subject your assembly to heat, try LOCTITE® ABLESTIK CT 5047-2. This low-temperature cure, high bond-strength adhesive is perfect for making electrical connections where hot soldering is impractical, or to conductive plastics when you can’t subject them to high temperatures. You can rely on an operating temperature of -40°C to 130°C (-40°F to 266°F).
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Informazioni tecniche

Numero dei componenti Bicomponente
Resistenza al taglio, Alluminio 1000.0 psi
Resistività di volume, Cured 24 hours @ 25 °C 0.002 Ohm cm
Schema di polimerizzazione, @ 65.0 °C 2.0 ora
Temperatura di esercizio -40.0 - 130.0 °C
Temperatura di stoccaggio 25.0 °C
Tipo di polimerizzazione Polimerizzazione a caldo