LOCTITE® ABLESTIK CE 8500
Caratteristiche e vantaggi
Solventless electrically conductive adhesive that combines low stress with good adhesion on nearly all surfaces, and has an operating temperature of -45°C to 200°C (-49°F to 392°F).
When you need high temperature characteristics in an electrically conductive adhesive with bond stress absorbing properties, LOCTITE® ABLESTIK CE 8500 is a great choice. This product offers great adhesion on nearly all surfaces and is ideal for CTE-mismatched situations. An excellent alternative to soldering for overall superior performance.
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Informazioni tecniche
| Aspetto fisico | Pasta |
| Numero dei componenti | Monocomponente |
| Resistenza al taglio | 450.0 psi |
| Resistività di volume | 0.0002 Ohm cm |
| Schema di polimerizzazione, @ 120.0 °C | 90.0 min. |
| Temperatura di esercizio | -45.0 - 200.0 °C |
| Temperatura di stoccaggio | -25.0 - 18.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
| Viscosità, Brookfield, @ 25.0 °C Speed 10 rpm | 120000.0 mPa.s (cP) |
LOCTITE® ABLESTIK CE 8500
Solventless electrically conductive adhesive that combines low stress with good adhesion on nearly all surfaces, and has an operating temperature of -45°C to 200°C (-49°F to 392°F).