LOCTITE® ABLESTIK QMI529HT-LV
Caratteristiche e vantaggi
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Informazioni tecniche
| Applicazioni | Die attach |
| Coefficiente di espansione termica (CTE) | 62.0 ppm/°C |
| Contenuto ionico estraibile, Cloruro (CI-) | 9.0 ppm |
| Contenuto ionico estraibile, Fluoruro (F-) | 9.0 ppm |
| Contenuto ionico estraibile, Potassio (K+) | 9.0 ppm |
| Contenuto ionico estraibile, Sodio (Na+) | 9.0 ppm |
| Modulo di trazione, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
| Resistenza al taglio matrice calda | 3.75 kg-f |
| Resistenza al taglio matrice temperatura ambiente | 20.0 kg-f |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® ABLESTIK QMI529HT-LV
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.