LOCTITE® ABLESTIK QMI529HT-LV
Features and Benefits
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Technical Information
| Applications | Die Attach |
| Coefficient of thermal expansion (CTE) | 62.0 ppm/°C |
| Cure type | Heat Cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Fluoride (F-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 3.75 kg-f |
| RT die shear strength | 20.0 kg-f |
| Tensile modulus, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
LOCTITE® ABLESTIK QMI529HT-LV
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.