The Henkel Adhesive Technologies GMM business covers technologies such as adhesives, sealings, coatings, cleaners, lubricants, equipment and packaging. We are interested and open to proposed innovations in these areas.

Increase Productivity, Improve Reliability, Simplify Design. Learn how LOCTITE^® Instant Adhesives support your design and manufacturing challenges.

Enabling sustainability across the metal packaging value chain

Discover Henkel's automotive web-seminar series designed to keep you up-to-date on the latest technology innovations

Lean how Henkel is Developing a Bond You Can Trust, with our Solutions for Automotive Interiors.

Welcome to the Henkel Printed Electronics ThINK Together Event Page –
A showcase for our digital events, offering first-hand insights on

• latest material innovations for stretchable, flexible & high-speed printable electronics,
• material processing advice to improve your screen printability
• recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces

Grab a coffee and listen into our latest video podcasts.

Enabling sustainability across the metal packaging value chain

Why it’s time Eastern European manufacturers prioritized eco-friendly initiatives.

Sustainability — it really is the current buzzword that features almost everywhere you look. And so it should be, as the effects of climate change are manifesting across every corner of the globe, with frightening speed and devastation.

Good Packaging Design Starts With the Right Components

Henkel through its well-known LOCTITE^® brand is partnering with Porsche in the ABB FIA Formula E World Championship.

10.0 W/m-K BERGQUIST^® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems

Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST^® LIQUI FORM TLF 10000.  The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.  

Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ...