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Less plastic waste, more innovation
Where convenience meets sustainability
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Lean how Henkel is Developing a Bond You Can Trust, with our Solutions for Automotive Interiors.
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Enabling sustainability across the metal packaging value chain
Why it’s time Eastern European manufacturers prioritized eco-friendly initiatives.
Sustainability — it really is the current buzzword that features almost everywhere you look. And so it should be, as the effects of climate change are manifesting across every corner of the globe, with frightening speed and devastation.
Good Packaging Design Starts With the Right Components
The TAG Heuer Porsche Formula E Team races in the ABB FIA Formula E World Championship, the most innovative motorsport series.
10.0 W/m-K BERGQUIST® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems
Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000. The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability.
Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ...