Smart Cards

Even with the growth of mobile pay applications, smart cards remain the secure transaction method of choice in most regions of the world. In terms of their size, the IC dies used in smart cards can range from very small (1.0 mm x 1.0 mm) to quite large (7.0 mm to 7.0 mm) and, therefore, require materials that can accommodate the processability and reliability requirements dictated by smart card manufacturing demands and in field use. For die attach materials, specifically, fast processing, low stress characteristics, good adhesion and encapsulant compatibility are critical to high-yield, high-volume production of reliable smart cards.

Henkel’s new smart card die attach formulation is designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market, including Henkel encapsulants, and ensures low contact angles for complete wetting and robust protection.

Smart Card Market Trends and Integrated Adhesive Solutions

Learn about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability. The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructures, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Card Solutions for the Electronics Industry

Resources for Smart Cards

White Paper: Low-Stress Die Attach for High Reliability Smart Cards