LOCTITE® ABLESTIK ABP 2032S
被称为 ABP 2032S (17G)
功能与优点
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK ABP 2032S electrically conductive adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in large die size package applications.
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技术信息
| RT 模剪切强度 | 16.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 29.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 19.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 19.0 ppm |
| 固化方式 | 热固化 |
| 应用 | 芯片焊接 |
| 拉伸模量, DMA @ 250.0 °C | 150.0 N/mm² (21755.0 psi ) |
| 推荐与以下物料搭配使用 | 引线框：金 |
| 热膨胀系数 (CTE) | 54.0 ppm/°C |
LOCTITE® ABLESTIK ABP 2032S
LOCTITE ABLESTIK ABP 2032S, Epoxy, Die Attach, Electrically Conductive Adhesive