Bergquist Brand Liquid Gap Fillers are expertly engineered, thermally-conductive gap filling liquid materials designed to enable dispensing application for high volume manufacturing operations. The materials provide excellent thermal and mechanical performance, while inducing virtually zero stress on components during assembly. Because they are liquid mediums, thermal gap filler materials can conform to highly intricate topographies and multi-level surfaces, delivering better wet-out for optimized thermal resistance that is generally lower than more solid pad-based mediums. Application volume and pattern is completely adaptable. 

Understanding the intricacies of balancing filler content, thermal conductivity requirements and equipment integrity, Henkel gap fillers are optimized liquid gap filler materials that can be deposited in extremely high volume for industries like automotive where large systems require maximum heat dissipation. Henkel has established strategic equipment partnerships with the world’s leading automated dispensing equipment companies and can customize solutions for dynamic applications.

Bergquist liquid gap fillers are supplied as a two-component, room or elevated temperature curing systems, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling heat producing devices with an adjacent metal case or heat sink. Thermally conductive liquid gap fillers are primarily for applications where stronger structural bonds are not required. If structural bonding is needed, Henkel thermal adhesives area an ideal solution. 

Two-Part Gap Fillers

Ultra Low Modulus: Minimal Stress During Assembly

Because gap fillers are dispensed and wet-out in a liquid state, the materials will create virtually zero stress on components during the assembly process. Thermal liquid gap fillers can be used to interface even the most fragile and delicate devices.

Excellent Conformability to Intricate Geometries

Liquid gap filler materials are able to conform to intricate topographies, including multi-level surfaces. Due to their flowability prior to cure, Gap Fillers can fill small air voids, crevices, and holes, reducing overall thermal resistance to the heat generating device.

Single Solution for Multiple Applications

Unlike pre-formed gap filling materials, liquid gap fillers offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications.

Efficient Material Usage

Manual or semi-automatic dispensing tools can be used to apply liquid thermal gap filling material directly to the target surface, resulting in an efficient use of material with minimal waste. Further material volume optimization can be achieved with implementation of automated dispensing equipment, which allows for precise material placement and reduces the material application time.

Customizable Flow Characteristics

Although thermal liquid gap fillers are designed to flow easily with minimal pressure, they are thixotropic in nature which helps the material remain in place after dispensing and prior to cure. Bergquist Gap Filler offerings include a range of rheological characteristics and can be tailored to meet customer-specific flow requirements from self-leveling to highly thixotropic materials that maintain their form as dispensed.

Applying Gap Filler

Gap Filler vs. Thermal Gel

For manufacturing operations where a one-part material is preferred over a two-part material that requires mixing, Bergquist thermal gels may be selected as an alternative to liquid gap fillers. Thermal gels are most often used for stationary applications such as those found within the telecom sector, whereas heat dissipating liquid gap fillers are frequently specified in markets such as automotive where high reliability is required and, post cure, the material can withstand extremely harsh environments.

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Liquid Gap Filler Applications and Industries

Gap fillers are ideally suited for applications where pad configurations are not the first choice, and can be used to replace grease or potting compounds. They are currently used in many industries, including:

Resources for Liquid Gap Fillers