Bergquist Gap Fillers are expertly engineered, thermally-conductive gap filling liquid materials designed to enable dispensing application for high volume manufacturing operations. The materials provide excellent thermal and mechanical performance, while inducing virtually zero stress on components during assembly. Because they are liquid mediums, thermal Gap Filler materials can conform to highly intricate topographies and multi-level surfaces, delivering better wet-out for optimized thermal resistance that is generally lower than more solid pad-based mediums. Application volume and pattern is completely adaptable.
Understanding the intricacies of balancing filler content, thermal conductivity requirements and equipment integrity, Henkel Gap Fillers are optimized liquid gap filler materials that can be deposited in extremely high volume for industries like automotive where large systems require maximum heat dissipation. Henkel has established strategic equipment partnerships with the world’s leading automated dispensing equipment companies and can customize solutions for dynamic applications.
Bergquist Gap Fillers are supplied as a two-component, room or elevated temperature curing systems, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling heat producing devices with an adjacent metal case or heat sink. Thermally conductive Gap Fillers are primarily for applications where stronger structural bonds are not required. If structural bonding is needed, Henkel thermal adhesives area an ideal solution.