BERGQUIST® GAP FILLER TGF 4500CVO
Vlastnosti a výhody
A high thermally conductive liquid gap filler for easy, precision dispensing and low stress assembly. Controlled volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 4500CVO is a 4.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It offers infinite thickness variation without causing additional stress to components, and the formula ensures optimal viscosity for efficient automated dispensing processes. This product is curable at room temperature, but the cure rate can be accelerated by applying heat.
Viac info
Dokumenty na prevzatie
Hľadáte TL alebo KBÚ v inom jazyku
Ďalšie dokumenty
Technické informácie
Prevádzková teplota | -60.0 - 200.0 °C |
Skladovateľnosť, @ 25.0 °C | 180.0 deň |
Spôsob vytvrdzovania | Vytvrdzovanie pri izbovej teplote (okolité prostredie), Vytvrdzovanie teplom |
Tepelná vodivosť | 4.5 W/mK |