LOCTITE® ABLESTIK 561KAP

Elementi i pogodnosti

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LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Tehnički List
LOCTITE® ABLESTIK 561KAP
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Tehnički podaci

Fizički oblik Folija
Raspored polimerizacije, @ 125.0 °C 2.0 sat
Sila smicanja, Aluminijum 1800.0 psi
Tip nosača Poliimid
Tip očvršćavanja Očvršćavanje pomoću zagrevanja