LOCTITE® ABLESTIK 561KAP

Características e Vantagens

LOCTITE ABLESTIK 561KAP, Epoxy Film, Component assembly, Assembly film
LOCTITE® ABLESTIK 561KAP is designed for bonding materials with mismatched coefficients of thermal expansion. In many bonding applications, components may be repaired. Component joined with LOCTITE ABLESTIK 561KAP adhesive can be debonded by heating the assembly to 150°C and sliding a thin blade, such as a razor blade, between the bonded surfaces.
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Informação Técnica

Cronograma de cura, @ 125.0 °C 2.0 h.
Forma física Película
Força de cisalhamento, Alumínio 1800.0 psi
Tipo de cura Cura de Calor
Tipo de operadora Poliimida