LOCTITE® ABLESTIK C 990 333

Features and Benefits

LOCTITE ABLESTIK C 990 333, Epoxy, Die attach
LOCTITE® ABLESTIK C 990 333 silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
Read More

Technical Information

Applications Die attach
Cure type Heat cure
Number of components 1 part
Storage temperature -25.0 - -18.0 °C
Viscosity, @ 25.0 °C 24000.0 mPa·s (cP)