LOCTITE® ABLESTIK C 990 333
Features and Benefits
LOCTITE ABLESTIK C 990 333, Epoxy, Die attach
LOCTITE® ABLESTIK C 990 333 silver filled epoxy adhesive is specially suited for die and component bonding in microelectronic applications.
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Documents and Downloads
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Technical Information
| Applications | Die Attach |
| Cure type | Heat Cure |
| Number of components | 1 Part |
| Storage temperature | -25.0 - -18.0 °C |
| Viscosity, @ 25.0 °C | 24000.0 mPa·s (cP) |
LOCTITE® ABLESTIK C 990 333
LOCTITE ABLESTIK C 990 333, Epoxy, Die attach