Henkel Dual Cure Adhesives Enables Camera Module Success The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate. Read More
2018-05-24 Whitepaper: High Power Density Applications Enabled by New Thermal Interface Material Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices. Read More