Bergquist brand thermal solutions control heat within multiple applications, enabling optimal performance and extending device lifetime.

For over 50 years, Bergquist brand products have been the world’s most trusted thermal management materials. Multi-award-winning formulations in various mediums provide essential heat dissipation for applications within numerous markets including automotive, consumer, telecom/datacom, power and industrial automation, computing, communication and many others. As electronic systems integrate more capability into increasingly challenging, complex designs and compact footprints, efficient heat control is necessary to maximize performance and limit heat-related failures. Henkel’s Bergquist thermal management materials, including GAP PAD® gap fillers, SIL PAD® thermal interface products, phase change materials, microTIMs, LIQUI FORM products and thermal adhesives tackle today’s toughest thermal control challenges.

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Exploring Henkel's BERGQUIST brand of Thermal Interface Materials (TIM)

Across market sectors and applications, higher performance, greater function, smaller footprints and increased power densities are driving the requirement for more effective heat dissipating solutions. Whether its automotive batteries, motor drives and power electronics, or optical modules in modern hyperscale datacenters, thermal control is critical for optimal, unfailing operation. When it comes to thermal interface materials and thermal control expertise, Bergquist is the most trusted brand on the market. Learn about our broad portfolio and find the right solution for your application.

Thermal Material Solutions for Smart Devices

Thermal Material Applications and Industries

Henkel’s extensive thermal management portfolio is facilitating heat dissipation for improved performance in numerous applications.  Thermal interface materials for automotive battery thermal management, power electronics, 5G infrastructure and datacenters, consumer devices, and many other electronics applications are delivering essential cooling for optimized function. 


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Resources to Thermal Interface Materials