Thermal Management Materials
Developer and manufacturer of market-leading BERGQUIST® brand thermal management solutions
Bergquist brand thermal solutions control heat within multiple applications, enabling optimal performance and extending device lifetime.
For over 50 years, Bergquist brand products have been the world’s most trusted thermal management materials. Multi-award-winning formulations in various mediums provide essential heat dissipation for applications within numerous markets including automotive, consumer, telecom/datacom, power and industrial automation, computing, communication and many others. As electronic systems integrate more capability into increasingly challenging, complex designs and compact footprints, efficient heat control is necessary to maximize performance and limit heat-related failures. Henkel’s Bergquist thermal management materials, including GAP PAD® gap fillers, SIL PAD® thermal interface products, phase change materials, microTIMs, LIQUI FORM products and thermal adhesives tackle today’s toughest thermal control challenges.
