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Thermal Management Materials

Thermal Management Materials

Developer and manufacturer of market-leading BERGQUIST® brand thermal management solutions

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BERGQUIST® brand materials are the world's most trusted thermal management products. Part of Henkel Corporation since 2014, BERGQUIST is backed by Henkel's expansive global footprint, state-of-the-art R&D resource and unmatched service and support network. BERGQUIST thermal management solutions provide reliability-enhancing, heat-dissipating performance in multiple markets and applications including automotive, consumer, industrial, telecom/datacom, computing, and communication, among others.

Henkel's BERGQUIST Thermal Management Solutions

Thermal Interface Materials

Thermal solutions in multiple forms, configurations and chemistry platforms that control heat in a variety of electronic applications.

Cropped photo of various thin sil pads in different sizes, shapes, colors, rolls and configurations for electronic thermal management solutions

Thermal Clad Insulated Metal Substrate (IMS®)

TCLAD® insulated metal substrates provide an effective alternative to conventional FR4 PCBs for higher power surface mount applications.

Exploring Henkel's BERGQUIST brand of Thermal Interface Materials (TIM)

News & Insights

Micro Thermal Interface Coating from Henkel Lowers Networking Line Card Heat for Optimized Datacenter

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard. While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal.

Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...

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