Thermal Management Materials

Thermally conductive, liquid gap filling materials

Designed to fill air gaps and enhance thermal conductivity

Electrically and non-electrically insulating thermal materials for cleaner and more efficient thermal interfaces

High structural bond strength in severe environments

Effective alternative to thermal greases, saving time and money without sacrificing thermal performance

Ensuring high thermal transfer on an interface, alongside superior surface wetting and minimal bondline thicknesses

Henkel announces it has signed an agreement to acquire the privately-held global thermal management solutions supplier The Bergquist Company.

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...