Underfill Solutions for Industrial Applications Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas. Author: Stieven Josso Read More
Integrated Advanced Underfill Solutions Over the past decade, we have seen a significant growth in the mobile computing market which has propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies in order to continue boosting performance and functionality per market demands. Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages. In this webinar, we will cover Henkel’s broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip- chip interconnect technology across different market segments. Fine pitch Cu Pillar... Read More
2018-12-10 High Operating Temperature Underfill from Henkel Delivers Protection for Aero and Auto Electronics High-performance material raises device reliability within challenging environments Read More
Whitepaper: Epoxy Flux Technology Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps. Read More