2018-12-10 High Operating Temperature Underfill from Henkel Delivers Protection for Aero and Auto Electronics High-performance material raises device reliability within challenging environments Read More
Whitepaper: Epoxy Flux Technology Designed to offer process efficiency, epoxy flux underfills deliver a fluxing component that facilitates solder joint formation as well as an epoxy system that offers added device protection by encapsulating individual bumps. Read More
