Application Challenges and Objectives

Data center Ethernet switch manufacturers must tackle the requirement for accelerating data rates and the challenges that presents.

A high power, high wattage data center line card with multiple processors required a robust, heat management solution to optimize performance. 

A rail customer had quality, efficiency and health & safety issues with a competitor product. Read more about how Henkel helped to solve this.

Customer Challenges
Increased production demand for the customer’s low-voltage power distribution enclosure systems dictated a faster, more efficient gasketing approach. 

Customer Challenge

• The customer’s new design for a DC-DC power converter required a more efficient, high-volume solution for the application of thermal management materials. 
  
  
• For previous-generation designs, silicone pads were applied in several locations between the DC-DC converter’s printed circuit board and metal housing. Use of the pads presented several inventory and production-related issues, including:
  
  - Operator handling difficulty of the thin sheets
  - Manual and time-consuming application process
  - Sourcing of silicone pads in many different sizes and thicknesses
  
  
• Any new material solution had to provide similar or better thermal performance as that achieved with the silicone pads. 

Customer Challenge

• The customer’s new design for a power supply used in a high-power industrial application incorporates several discrete packages, making traditional mechanical attachment processes inefficient.
• In addition, the system’s power levels, high breakdown voltage and heat generation suggested that use of conventional adhesives as a mechanical replacement could not deliver the thermal performance necessary. 
• The customer aimed to reduce overall manufacturing costs, while improving production efficiency, performance and yield.