Durable, Thin Thermal Interface Coating Reduces Heat And Improves Data Center Switch Performance Application Challenges and Objectives Data center Ethernet switch manufacturers must tackle the requirement for accelerating data rates and the challenges that presents. Read More
Data Center Line Card Raises Operating Performance with Low Thermal Resistance Phase Change TIM A high power, high wattage data center line card with multiple processors required a robust, heat management solution to optimize performance. Read More
Success Stories Improving efficiency and quality with an NHV sustainable solutions A rail customer had quality, efficiency and health & safety issues with a competitor product. Read more about how Henkel helped to solve this. Read More
Sonderhoff Gasketing Total Process Solution for Low-Voltage Power Distribution System Customer Challenges Increased production demand for the customer’s low-voltage power distribution enclosure systems dictated a faster, more efficient gasketing approach. Read More
Automation-Friendly Liquid Gap Filler Delivers on Thermal Control, High Throughput Requirements for DC-DC Power Converter Customer Challenge The customer’s new design for a DC-DC power converter required a more efficient, high-volume solution for the application of thermal management materials. For previous-generation designs, silicone pads were applied in several locations between the DC-DC converter’s printed circuit board and metal housing. Use of the pads presented several inventory and production-related issues, including: - Operator handling difficulty of the thin sheets - Manual and time-consuming application process - Sourcing of silicone pads in many different sizes and thicknesses Any new material solution had to provide similar or better thermal performance as that achieved with the silicone pads. Read More
BOND PLY Increases Production Efficiency, Lowers Cost for High-Power Industrial Application Customer Challenge The customer’s new design for a power supply used in a high-power industrial application incorporates several discrete packages, making traditional mechanical attachment processes inefficient. In addition, the system’s power levels, high breakdown voltage and heat generation suggested that use of conventional adhesives as a mechanical replacement could not deliver the thermal performance necessary. The customer aimed to reduce overall manufacturing costs, while improving production efficiency, performance and yield. Read More