Join Henkel's Automotive Web-Seminar Discover Henkel's automotive web-seminar series designed to keep you up-to-date on the latest technology innovations Read More
Web-Seminar on Developing a Bond You Can Trust, Henkel's Solutions Automotive Interiors Lean how Henkel is Developing a Bond You Can Trust, with our Solutions for Automotive Interiors. Read More
Printed Electronics ThINK Together Events Welcome to the Henkel Printed Electronics ThINK Together Event Page – A showcase for our digital events, offering first-hand insights on latest material innovations for stretchable, flexible & high-speed printable electronics, material processing advice to improve your screen printability recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces Grab a coffee and listen into our latest video podcasts. Read More
PB-Free and Halogen-Free Solder for High Reliability Applications Webinar The RoHS directive has been well-publicized but often not fully understood. This webinar provides updates on the requirements of the legislation and how, in light of the move to lead-free, electronics assembly professionals can achieve high reliability. The webinar provides information on when to make the switch to Pb-free in the automotive and industrial markets, receive detailed reliability comparisons of SnPb versus Pb-free alloys, discussion of failure mechanisms and the limitations of SAC alloys, information on the distinction between a differentiation standard and high reliability and much, much more. Author: Ian Wilding Read More
Underfill Solutions for Industrial Applications Over the last years there was already an increased interest for underfill materials noticeable in the industrial markets due to the switch from Pb-containing to Pb-free solders. The relative brittleness of the Pb-free solder isn’t coping with the high mechanical forces (vibrations and shocks), humidity requirements and CTE mismatches induced by the harsh temperatures, resulting in solder fatigue. Besides this, applications coming from other markets are finding their way to the industrial areas like for instance the “infotainment” applications and surround view cameras in cars. These aren’t used to the harsher requirements resulting in unexpected failures. Using capillary underfill will help you to deal with the CTE mismatches, humidity and other contaminants to prevent these failures. This webinar will focus on the industrial market trends and requirements and how they relate to our product portfolio and research areas. Author: Stieven Josso Read More
Simplified New Approaches to High Thermal Die Attach Webinar Industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation discuss the market conditions driving a new approach to high thermal conductive die attach materials and processes. Read More
