LOCTITE® ABLESTIK ABP 2288A
Features and Benefits
LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste
LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 170.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 13.0 °C |
| Thermal conductivity | 0.6 W/mK |
| Thixotropic index | 4.4 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 8500.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2288A
LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste