LOCTITE® ABLESTIK ABP 2288A

Features and Benefits

LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste
LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 80.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 170.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 13.0 °C
Thermal conductivity 0.6 W/mK
Thixotropic index 4.4
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 8500.0 mPa·s (cP)