LOCTITE® ABLESTIK ABP 2450
特長および利点
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 2450 die attach is formulated for use in high brightness LED manufacturing applications. This material is formulated to have a low moisture uptake and high light stability performance to extend LED lamp product life.
詳細はこちら
技術情報
| アプリケーション(用途) | ダイ接着剤 |
| ガラス転移温度 (Tg) | 67.0 °C |
| チクソ性指数 | 5.5 |
| 熱膨張率 | 61.0 ppm/°C |
| 熱膨張率, Above Tg | 118.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
| 粘度、ブルックフィールド DV-II, @ 25.0 °C Speed 5 rpm | 14000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 2450
LOCTITE ABLESTIK ABP 2450, BMI Hybrid, Heat cure