LOCTITE® ECCOBOND EN 1350
Features and Benefits
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications.
- Non-conductive
- Fast cure at low temperatures
- Low temperature cure
- Water resistant
- High temperature resistance
Documents and Downloads
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Technical Information
| Applications | Encapsulating |
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 27.0 ppm/°C |
| Color | Black |
| Cure schedule, @ 120.0 °C | 1.0 hr. |
| Cure type | Heat Cure |
| Glass transition temperature (Tg) | 103.0 °C |
| Mix ratio, by weight | 100 : 2.8 |
| Number of components | 2 Part |
| Shelf life | 183.0 day |
| Shore hardness, Shore D | 90.0 |
| Storage temperature | 25.0 °C |
| Tensile modulus, DMA @ 25.0 °C | 7500.0 N/mm² (1087783.0 psi , 7.5 GPa ) |
LOCTITE® ECCOBOND EN 1350
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant