LOCTITE ECCOBOND EN 1350
fitur dan keuntungan
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications.
- Non-conductive
- Fast cure at low temperatures
- Low temperature cure
- Water resistant
- High temperature resistance
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Enkapsulasi |
| Jadwal Pengerasan, @ 120.0 °C | 1.0 hr. |
| Kekerasan Shore, Shore D | 90.0 |
| Koefisien Muai Termal (CTE), Above Tg | 100.0 ppm/°C |
| Koefisien Muai Termal (CTE), Below Tg | 27.0 ppm/°C |
| Modulus Tensil, DMA @ 25.0 °C | 7500.0 N/mm² (1087783.0 psi , 7.5 GPa ) |
| Nomor Komponen | 2 Part |
| Rasio Campuran, menurut Berat | 100 : 2.8 |
| Suhu Penyimpanan | 25.0 °C |
| Suhu Transisi Kaca (Tg) | 103.0 °C |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
| Umur Simpan | 183.0 day |
| Warna | Hitam |
LOCTITE ECCOBOND EN 1350
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant