BERGQUIST® GAP PAD® TGP 2101SF
U svojstvu Gap Pad® 2101SF
Značajke i prednosti
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2101SF is a silicone-free, high performance, thermally conductive gap filling material. The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications. BERGQUIST GAP PAD TGP 2101SF is reinforced for easy material handling and added durability during assembly. BERGQUIST GAP PAD TGP 2101SF offers exceptionally low interfacial resistances to adjacent surfaces and is constructed using a 1 mil polyester film on one side and natural tack on the other . The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Tehnički podaci
Boja | Zelena |
Radna temperatura | -60.0 - 125.0 °C |
Toplinska vodljivost | 2.0 W/mK |
Uobičajena debljina | 0.254 - 3.175 mm |
Vrsta nosača | Poliester |
Youngov modul, ASTM D575 | 228.0 KPa (33.0 psi ) |