BERGQUIST® GAP PAD® TGP EMI1000

Known as Gap Pad® EMI 1.0

Features and Benefits

This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.
BERGQUIST® GAP PAD TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 
  • Thermal conductivity: 1.0 W/m-K 
  • Electromagnetic Interference (EMI) absorbing
  • Fiberglass-reinforced for puncture, shear & tear resistance
  • Highly conformable, low hardness
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Technical Information

Color Black
Density 2.4 g/cm³
Dielectric breakdown voltage 1700.0 Vac
Dielectric constant, @ 1kHz 6.0
Flame rating V-0
Heat capacity, ASTM E1269 1.3 J/g-K
Operating temperature -60.0 - 200.0 °C
Shore hardness, Thirty second delay value, ASTM D2240 Bulk Rubber Shore 00 5.0
Standard thickness 0.508 - 3.175 mm
Thermal conductivity 1.0 W/mK
Volume resistivity 1×10 Ohm m