BERGQUIST® GAP PAD® TGP EMI1000

Conhecido como Gap Pad® EMI 1.0

Características e Benefícios

This thermally conductive, silicone-based, fiberglass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.
BERGQUIST® GAP PAD TGP EMI1000 is a highly conformable, fiberglass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent, natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 
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Informação Técnica

Capacidade de calor, ASTM E1269 1.3 J/g-K
Classificação da chama V-0
Condutividade térmica 1.0 W/mK
Constante dielétrica, @ 1kHz 6.0
Cor Preto
Densidade 2.4 g/cm³
Dureza shore, Thirty second delay value, ASTM D2240 Borracha à granel Shore 00 5.0
Espessura padrão 0.508 - 3.175 mm
Resistividade volumétrica 1×10 Ohm m
Temperatura de operação -60.0 - 200.0 °C
Tensão de ruptura dielétrica 1700.0 Vac